中国台湾二季度晶圆代工收入同比增长19%至154亿美元
. 中国台湾二季度晶圆代工收入同比增长19%至154亿美元
智通财经APP获悉，8月13日，中国台湾半导体产业协会称，2021年第二季中国台湾整体IC产业产值达333亿美元，较上季成长9.0%，较2020年同期成长31.6%。其中，IC设计业产值为109亿美元，环比增长17.9%，同比增长63.3%；IC制造业为179亿美元，环比增长5.7%，同比增长23.7%，其中，晶圆代工为154亿美元，环比增长4.1%，同比增长19.0%，存储器与其他制造为25亿美元，环比增长16.4%，同比增长64.0%；IC封装业为34亿美元，环比增长3.7%，同比增长12.1%；IC测试业为17亿美元，环比增长6.5%，同比增长12.6%。
该行业组织把2021年总体行业收入预测上调至1358亿美元；之前预测为1285亿美元。
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